LTD BE Etch Module Development Engineer
Intel Corporation
US, United States of America
Job posting number: #7326212 (Ref:JR0282074)
Posted: March 24, 2026
Job Description
Job Details:
Job Description:
In this role, you will be an integral contributor to next‑generation patterning process development and First‑of‑Kind (FOK) tool installation, development, and qualification. You will work in a dynamic, collaborative environment solving complex technical problems on sophisticated manufacturing processes and equipment while partnering closely with cross‑functional stakeholders.
Note: This role requires regular onsite presence to fulfill essential job responsibilities.
Key Responsibilities (may include but are not limited to)
Support FOK tool install, bring‑up, development, and qualification activities for Back End Etch modules.
Contribute to the development of next‑generation patterning processes; execute learning cycles from early development through qualification.
Work with cross‑functional teams (e.g., Integration, Manufacturing, Equipment, Yield/Defect, and suppliers) to solve technical process and defect issues.
Plan and conduct experiments (e.g., DOE) to characterize process performance throughout the development cycle.
Establish and improve process control systems to optimize and sustain production performance (e.g., SPC, control plans, response plans).
Drive improvements in quality, reliability, cost, yield, process stability/capability, productivity, and safety/ergonomics within the module scope.
Develop structured strategies to resolve difficult problems and help implement mechanisms to prevent recurrence (sustaining systems, standard work, controls).
Behavioral Traits (Ideal Candidate)
Demonstrated ability to analyze complex technical issues and identify a clear solution path.
Self‑directed, shows initiative, and can work independently with minimal direction.
Strong communication skills; can summarize complex data sets for both technical and non‑technical audiences.
Collaborative mindset and comfort working across multiple teams and priorities.
Qualifications:
Minimum Qualifications:
Master’s degree in Chemical Engineering, Materials Science, Physics, Electrical Engineering, Mechanical Engineering, Chemistry, or related STEM field.
Experience (academic research, internship, or industry) with semiconductor process development, manufacturing, equipment engineering, or related experimental work.
Experience planning and executing experiments and analyzing data (e.g., JMP, Python, SQL, MATLAB, Excel).
Willingness and ability to work onsite regularly to support tool and process development needs.
Preferred Qualifications:
Hands‑on cleanroom/fab experience.
Familiarity with etch process fundamentals, defect/yield problem solving, and/or process controls (SPC/DOE).
Experience collaborating with cross‑functional teams and documenting technical learnings.
Primary Location
US, Oregon, Hillsboro
Job Type:
College GradShift:
Shift 1 (United States of America)Primary Location:
US, Oregon, HillsboroAdditional Locations:
Business group:
Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.Posting Statement:
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of Trust
N/ABenefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $115,110.00-162,500.00 USDThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.Work Model for this Role
This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.*
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.


